The 4th South-East Europe Design Automation, Computer Engineering, Computer Networks and Social Media Conference (SEEDA-CECNSM 2019), in its 4th year, will provide an insight into the unique world stemming from the interaction between the fields of computer engineering, networks and design automation (DA). SEEDA-CECNSM 2019 will provide an international technical forum for experts from the engineering industry and academia to exchange ideas, innovations, and present results of on-going research in the most state-of-the-art areas. This year, special focus will be on the challenging issues related to all the opportunities of computer engineering, networks and design automation in the era of the integration of Internet of Things, Cloud Computing and Cyber-Physical Systems.

TOPICS OF INTEREST
—
Design Automation (DA)
– Artificial Intelligence and Applications
– Backend Silicon Tools and Methodologies
– CAD Tools and Algorithms
– Characterisation and Timing Simulation
– Design for Low Power
– Design Optimization and Implementation
– ESL Methodologies and EDA Tools
– FPGAs, ASICs, ASIPs and SoCs
– Numerical and Scientific Computation
– Open-Source Tools
– Placement & Routing
– Rapid Prototyping and Hardware/Software Co-verification and Co-design
– Silicon Device Level Research
– System-Level and High-Level Synthesis
– VLSI and Digital Design and Design for Test
– Reconfigurable computing and FPGA-based acceleration
– Approximate computing
– System level and architecture level dependability
– Safe and secure embedded systems

Computer Networks and Communications
– Advances in Internet Protocols
– Cloud and Fog Computing
– Intelligent Agents and Distributed Computing
– Internet of Things and Smart Cities
– Internet Services and Applications
– Management of Telecommunications and Networks
– Mobile, Ad Hoc and Sensor Network Optimization and Management
– Security and Privacy
– Ubiquitous Computing, Services and Applications
– Web Services and Service Oriented Architectures
– Wireless, Cellular, and Mobile Communications

Computer Engineering
– Computer Architecture and Design
– Formal Methods in Architecture Design
– Computer-Aided Architecture Design and Implementation
– Embedded Systems and Applications
– Multi-core VLSI/ULSI Design
– Parallel and other Advanced Architectures
– Distributed Computing
– Memory and Storage Systems
– Parallel programming, parallel computing and ILP
– Advanced I/O device design
– Human-Computer Interaction
– Embedded and Cyber-Physical Systems
– Industrial informatics
– Heterogeneous many/multi-core computing

Social Media and e-technologies
– Active and Collaborative Learning
– Advances in e-Energy Design and Development
– Digital Media Technologies
– e-Commerce and e-Services
– Economic and Regulatory Issues
– e-Government Issues
– e-Health Technologies and Applications
– Game-Based Learning for Engineering Education
– Image Processing and Visualization
– Social Networks in Education
– Social Networks, Crowdsourcing, and Crowdsensing

Submission Guidelines
(1) Review manuscripts should describe original work and should be no more than 8 pages in the IEEE double column proceedings format including tables, figures and references. Note that accepted papers up to 6 pages will be published with no additional charge. Exceeding pages will be charged an additional fee. Only registered and presented papers will be published in the conference proceedings. Please use the IEEE template as described here.

(2) All papers for SEEDA-CECNSM 2019 should be submitted via EasyChair using https://easychair.org/conferences/?conf=seedacecnsm2019

Publication
Accepted papers will be included in the SEEDA-CECNSM 2019 Proceedings and will be submitted for inclusion to the IEEE Xplore. The SEEDA-CECNSM Proceedings have been indexed by dblp and Scopus. This makes the SEEDA-CECNSM conference one of the publication venues with very high visibility and impact in both Computer and Communications areas.

Important Dates
– Paper Submission Deadline: Apr 24, 2019  June 05, 2019  June 29, 2019
– Notification of paper acceptance: May 21, 2019 June 25, 2019 July 06, 2019
– Camera-Ready Papers Due: June 20, 2019 July 15, 2019 July 20, 2019
– Conference: September 20-22, 2019

Technical Program Committee Co-Chairs
Athanasios Kakarountas, University of Thessaly
Foivos Mylonas, Ionian University
Michalis Psarakis, University of Piraeus
Cleio Sgouropoulou, University of West Attica
Georgios Stamoulis, University of Thessaly